Intel Computer Hardware 955X User Manual

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Intel® 955X Express Chipset  
Thermal/Mechanical Design Guide  
– For the Intel® 82955X Memory Controller Hub (MCH)  
April 2005  
Document Number: 307012-001  
 
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Contents  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Figures  
Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach  
Tables  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
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Revision History  
Revision  
Number  
Description  
Revision Date  
-001  
Initial Release.  
April 2005  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
Introduction  
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1 Introduction  
As the complexity of computer systems increases, so do the power dissipation requirements. Care  
must be taken to ensure that the additional power is properly dissipated. Typical methods to  
improve heat dissipation include selective use of ducting, and/or passive heatsinks.  
The goals of this document are to:  
Outline the thermal and mechanical operating limits and specifications for the Intel® 82955X  
Express Chipset Memory Controller Hub (MCH).  
Describe a reference thermal solution that meets the specification of the 82955X MCH.  
Properly designed thermal solutions provide adequate cooling to maintain the MCH die  
temperatures at or below thermal specifications. This is accomplished by providing a low local-  
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient  
thermal resistance. By maintaining the MCH die temperature at or below the specified limits, a  
system designer can ensure the proper functionality, performance, and reliability of the chipset.  
Operation outside the functional limits can degrade system performance and may cause  
permanent changes in the operating characteristics of the component.  
The simplest and most cost effective method to improve the inherent system cooling  
characteristics is through careful design and placement of fans, vents, and ducts. When additional  
cooling is required, component thermal solutions may be implemented in conjunction with system  
thermal solutions. The size of the fan or heatsink can be varied to balance size and space  
constraints with acoustic noise.  
This document addresses thermal design and specifications for the 82955X MCH component  
only. For thermal design information on other chipset components, refer to the respective  
component datasheet. For the ICH7, refer to the Intel® I/O Controller Hub 7 (ICH7) Thermal  
Design Guidelines.  
Note: Unless otherwise specified, the term MCH refers to the Intel® 82955X Express chipset MCH.  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Introduction  
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1.1  
Definition of Terms  
Term  
Description  
BGA  
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is  
mounted, bonded and encapsulated in molding compound. The primary electrical interface is  
an array of solder balls attached to the substrate opposite the die and molding compound.  
BLT  
Bond line thickness. Final settled thickness of the thermal interface material after installation  
of heatsink.  
ICH7  
I/O Controller Hub. Seventh generation I/O Controller Hub component that contains  
additional functionality compared to previous ICH components. The I/O Controller Hub  
component that contains the primary PCI interface, LPC interface, USB2, ATA-100, and  
other I/O functions. It communicates with the MCH over a proprietary interconnect called  
DMI.  
MCH  
Memory Controller Hub. The chipset component that contains the processor interface, the  
memory interface, and the DMI.  
Tcase_max  
Tcase_min  
TDP  
Maximum die temperature allowed. This temperature is measured at the geometric center of  
the top of the package die.  
Minimum die temperature allowed. This temperature is measured at the geometric center of  
the top of the package die.  
Thermal design power. Thermal solutions should be designed to dissipate this target power  
level. TDP is not the maximum power that the chipset can dissipate.  
1.2  
Reference Documents  
The reader of this specification should also be familiar with material and concepts presented in  
the following documents:  
Document Title  
Document Number / Location  
Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines  
Intel® I/O Controller Hub 7 (ICH7) Datasheet  
Intel® 955X Express Chipset Datasheet  
BGA/OLGA Assembly Development Guide  
Contact your Intel Field Sales  
Representative  
Various system thermal design suggestions  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
   
Packaging Technology  
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2 Packaging Technology  
The 955X Express chipset consists of two individual components: the MCH and the ICH7. The  
MCH component uses a 34 mm squared, 6-layer flip chip ball grid array (FC-BGA) package (see  
Figure 2-1 through Figure 2-3). For information on the ICH7 package, refer to the Intel® I/O  
Controller Hub 7 (ICH7) Thermal Design Guidelines.  
Figure 2-1. MCH Package Dimensions (Top View)  
Ø5.20mm  
CapacitorArea,  
HandlingExclusion  
Zone  
Die  
Keepout  
Area  
19.38  
10.67  
2.0  
MCH  
Die  
15.34  
9.14  
34.00  
3.0  
6.17  
HandlingArea  
2.54  
34.00  
955X_Pkg_TopView  
Figure 2-2. MCH Package Dimensions (Side View)  
0.84 ± 0.05 mm  
Substrate  
2.355 ± 0.082 mm  
1.92 ± 0.078 mm  
Decoup  
Cap  
Die  
0.7 mm Max  
0.20 See note 4.  
0.20 –C–  
See note 1.  
Seating Plane  
0.435 ± 0.025 mm  
See note 3  
Notes:  
1. Primary datum -C- and seating plan are defined by the spherical crow ns of the solder balls (show n before motherboard attach)  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994  
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm  
4. Show n before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bow l  
shaped)orientationafterreflow  
955X_Pkg_SideView  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Packaging Technology  
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Figure 2-3. MCH Package Dimensions (Bottom View)  
NOTES:  
1. All dimensions are in millimeters.  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.  
2.1  
Package Mechanical Requirements  
The MCH package has an exposed bare die that is capable of sustaining a maximum static normal  
load of 10-lbf. The package is NOT capable of sustaining a dynamic or static compressive load  
applied to any edge of the bare die. These mechanical load limits must not be exceeded during  
heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use  
condition.  
Note:  
1. The heatsink attach solutions must not result in continuous stress onto the chipset package  
with the exception of a uniform load to maintain the heatsink-to-package thermal interface.  
2. These specifications apply to uniform compressive loading in a direction perpendicular to the  
bare die top surface.  
3. These specifications are based on limited testing for design characterization. Loading limits  
are for the package only.  
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Thermal Specifications  
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3 Thermal Specifications  
3.1  
Thermal Design Power (TDP)  
Analysis indicates that real applications are unlikely to cause the chipset MCH to consume  
maximum power dissipation for sustained time periods. Therefore, to arrive at a more realistic  
power level for thermal design purposes, Intel characterizes power consumption based on known  
platform benchmark applications. The resulting power consumption is referred to as the Thermal  
Design Power (TDP). TDP is the target power level that the thermal solutions should be designed  
to. TDP is not the maximum power that the chipset can dissipate.  
For TDP specifications, see Table 3-1 for the 955X Express chipset MCH. FC-BGA packages  
have limited heat transfer capability into the board and have minimal thermal capability without a  
thermal solution. Intel recommends that system designers plan for one or more heatsinks when  
using the 955X Express chipset.  
3.2  
Die Case Temperature Specifications  
To ensure proper operation and reliability of the MCH, the die temperatures must be at or  
between the maximum/minimum operating range as specified in Table 3-1 for the 82955X MCH.  
System and/or component level thermal solutions are required to maintain these temperature  
specifications. Refer to Chapter 5 for guidelines on accurately measuring package die  
temperatures.  
Table 3-1. MCH Thermal Specifications  
Parameter  
Value  
Notes  
Tcase_max  
Tcase_min  
105 °C  
5 °C  
TDPdual channel  
13.5 W  
DDR2-667  
NOTE: These specifications are based on silicon characterization; however, they may be updated as further  
data becomes available.  
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Thermal Specifications  
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Thermal Simulation  
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4 Thermal Simulation  
Intel provides thermal simulation models of the 955X Express chipset MCH and associated user's  
guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in  
an integrated, system-level environment. The models are for use with the commercially available  
Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM”* (version 5.1  
or higher) by Flomerics, Inc. Contact your Intel field sales representative to order the thermal  
models and user's guides.  
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Thermal Simulation  
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Thermal Metrology  
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5 Thermal Metrology  
The system designer must make temperature measurements to accurately determine the thermal  
performance of the system. Intel has established guidelines for proper techniques to measure the  
MCH die temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH  
die temperatures. The flowchart in Figure 5-1 offers useful guidelines for thermal performance  
and evaluation.  
5.1  
Die Case Temperature Measurements  
To ensure functionality and reliability, the Tcase of the MCH must be maintained at or between the  
maximum/minimum operating range of the temperature specification as noted in Table 3-1. . The  
surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase  
requires special care to ensure an accurate temperature measurement.  
Temperature differences between the temperature of a surface and the surrounding local ambient  
air can introduce errors in the measurements. The measurement errors could be due to a poor  
thermal contact between the thermocouple junction and the surface of the package, heat loss by  
radiation and/or convection, conduction through thermocouple leads, and/or contact between the  
thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement  
accuracy, only the 0° thermocouple attach approach is recommended.  
5.1.1  
Zero Degree Angle Attach Methodology  
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of  
the heatsink base.  
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one  
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).  
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.  
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts  
should match the slot and hole milled into the heatsink base.  
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of  
the top surface of the die using a high thermal conductivity cement. During this step, ensure  
no contact is present between the thermocouple cement and the heatsink base because any  
contact will affect the thermocouple reading. It is critical that the thermocouple bead  
makes contact with the die (see Figure 5-3).  
6. Attach heatsink assembly to the MCH and route thermocouple wires out through the milled  
slot.  
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Thermal Metrology  
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Figure 5-1. Thermal Solution Decision Flowchart  
Start  
Attach  
thermocouples using  
recommended  
metrology. Setup the  
system in the desired  
configuration.  
Run the Power  
program and  
monitor the  
device die  
Attach device  
to board using  
normal reflow  
process.  
Tdie >  
Specification?  
No  
temperature.  
End  
Heatsink  
Required  
Select Heatsink  
Yes  
Therm_Solution_Flow  
Figure 5-2. Zero Degree Angle Attach Methodology  
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)  
Die  
Thermocouple  
Wire  
Cement +  
Thermocouple Bead  
Substrate  
0_Angle_Attach_Method  
NOTE: Not to scale.  
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Reference Thermal Solution  
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6 Reference Thermal Solution  
Intel has developed a reference thermal solution designed to meet the cooling needs of the MCH  
under operating environments and specifications defined in this document. This chapter describes  
the overall requirements for the Plastic Wave Soldering Heatsink (PWSH) reference thermal  
solution including critical-to-function dimensions, operating environment, and validation criteria.  
Other chipset components may or may not need attached thermal solutions, depending on your  
specific system local-ambient operating conditions. For information on the ICH7, refer to thermal  
specification in the Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines.  
6.1  
6.2  
Operating Environment  
The reference thermal solution was designed assuming a maximum local-ambient temperature of  
55 °C. The minimum recommended airflow velocity through the cross section of the heatsink fins  
is 350 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to  
the local-ambient temperature. The thermal designer must carefully select the location to measure  
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35 °C  
external-ambient temperature at sea level. (External-ambient refers to the environment external to  
the system.)  
Heatsink Performance  
Figure 6-1 depicts the measured thermal performance of the reference thermal solution versus  
approach air velocity. Since this data was measured at sea level, a correction factor would be  
required to estimate thermal performance at other altitudes.  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Reference Thermal Solution  
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Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach Velocity  
6.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or implementation  
requirements, the height, width, and depth constraints typically placed on the MCH thermal  
solution are shown in Figure 6-2.  
When using heatsinks that extend beyond the MCH reference heatsink envelope shown in  
Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot  
exceed 2.2 mm (0.087 in.) in height.  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
   
Reference Thermal Solution  
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Figure 6-2. Heatsink Volumetric Envelope for the MCH  
Ramp  
Retainer  
HeatsinkFin  
HeatsinkBase  
TIM  
Die  
FCBGA+Solder  
Balls  
Motherboard  
60.6mm  
48.0mm  
26.79mm  
HeatsinkFin  
Max2.2mm  
Component  
Height  
No  
component  
this Area  
135 O  
47.0mm  
HS_Vol_Envelope_MCH  
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Reference Thermal Solution  
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6.4  
Board-Level Components Keep-out Dimensions  
The location of hole patterns and keep-out zones for the reference thermal solution are shown in  
Figure 6-3 and Figure 6-4.  
Figure 6-3. MCH Heatsink Board Component Keep-out  
60.6mm  
48.0mm  
26.79mm  
HeatsinkFin  
Max 2.2mm  
Component  
Height  
No  
component  
this Area  
135O  
47.0mm  
Air Flow  
HS_Brd_Component_Keepout  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
   
Reference Thermal Solution  
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Figure 6-4. Retention Mechanism Component Keep-out Zones  
4x 8.76mm  
Max1.27mm  
Component  
Height  
NoComponents  
this Area  
8 x Ø0.97mm PlatedThruHole  
8 x Ø1.42 mmTrace Keepout  
RM_Component_KeepoutZones  
6.5  
Reference Heatsink Thermal Solution Assembly  
The reference thermal solution for the MCH is a passive extruded heatsink with thermal interface.  
It is attached using a clip with each end hooked through an anchor soldered to the board. Figure  
6-5 shows the reference thermal solution assembly and associated components.  
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in  
Appendix B. Appendix A contains vendor information for each thermal solution component.  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Reference Thermal Solution  
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Figure 6-5. Plastic Wave Soldering Heatsink Assembly  
6.5.1  
6.5.2  
Heatsink Orientation  
To enhance the efficiency of the reference thermal solution, it is important for the designer to  
orient the fins properly with respect to the mean airflow direction. Simulation and experimental  
evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are  
aligned with the mean airflow direction (see Figure 6-3).  
Extruded Heatsink Profiles  
The reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 6-5 shows  
the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with  
similar dimensions and increased thermal performance may be available. Full mechanical drawing  
of this heatsink is provided in Appendix B.  
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Reference Thermal Solution  
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Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile  
NOTE: All dimensions are in millimeters, with dimensions in braces expressed in inches.  
6.5.3  
6.5.4  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
Thermal Interface Material  
A TIM provides improved conductivity between the die and heatsink. The reference thermal  
solution uses Honeywell PCM 45F, 0.25 mm (0.010 in.) thick, 15 mm x 15 mm  
(0.59 in. x 0.59 in.) square.  
Note: Unflowed or “dry” Honeywell PCM 45F has a material thickness of 0.010 inch. The flowed or  
“wet” Honeywell PCM 45F has a material thickness of ~0.003 inches after it reaches its phase  
change temperature.  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Reference Thermal Solution  
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6.5.4.1  
Effect of Pressure on TIM Performance  
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This  
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled  
thickness of the thermal interface material after installation of heatsink. The effect of pressure on  
the thermal resistance of the Honeywell* PCM45F TIM is shown in Table 6-1. The heatsink clip  
provides enough pressure for the TIM to achieve a thermal conductivity of 0.17 °C inch2/W.  
Table 6-1 Honeywell PCM 45F TIM Performance as a Function of Attach Pressure  
Pressure (psi)  
Thermal Resistance (°C × in2)/W  
5
0.049  
0.046  
0.045  
0.044  
10  
20  
30  
Note: All measured at 50 °C.  
6.5.5  
6.5.6  
Heatsink Clip  
The retention mechanism in this reference solution includes two different types of clips; one is  
ramp clip and the other is wire clip. Each end of the wire clip is attached to the ramp clip that in  
turn attaches to anchors to fasten the overall heatsink assembly to the motherboard. See  
Appendix B for a mechanical drawing of the clip.  
Clip Retention Anchors  
For 955X Express chipset-based platforms that have very limited board space, a clip retention  
anchor has been developed to minimize the impact of clip retention on the board. It is based on a  
standard two-pin jumper and is soldered to the board like any common through-hole header. A  
new anchor design is available with 45° bent leads to increase the anchor attach reliability over  
time. See Appendix A for the part number and supplier information.  
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
 
       
Reference Thermal Solution  
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6.6  
Reliability Guidelines  
Each motherboard, heatsink and attach combination may vary the mechanical loading of the  
component. Based on the end user environment, the user should define the appropriate reliability  
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some  
general recommendations are shown in Table 6-2.  
Table 6-2. Reliability Guidelines  
Test1  
Requirement  
Pass/Fail Criteria2  
Mechanical Shock  
Random Vibration  
Temperature Life  
50 g, board level, 11 msec, 3 shocks/axis.  
Visual Check and Electrical  
Functional Test  
7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.  
Visual Check and Electrical  
Functional Test  
85°C, 2000 hours total, checkpoints at 168, 500,  
1000, and 2000 hours.  
Visual Check  
Thermal Cycling  
Humidity  
–5 °C to +70 °C, 500 cycles.  
Visual Check  
Visual Check  
85% relative humidity, 55 °C, 1000 hours.  
NOTES:  
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies  
from three lots of material.  
2. Additional pass/fail criteria may be added at the discretion of the user.  
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Reference Thermal Solution  
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Appendix A: Thermal Solution Component Suppliers  
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7 Appendix A: Thermal Solution  
Component Suppliers  
This list is provided by Intel solely as a convenience to customers. Intel has not tested, designed  
or validated these products and does not warrant user suitability or performance in any way.  
Customers are solely responsible for determining the suitability and application of these products  
for their designs.  
Table 7-1. MCH Heatsink Thermal Solution  
Intel Part  
Number  
Supplier  
(Part Number)  
Part  
Contact Information  
Monica Chih (Taiwan)  
Heatsink Assembly  
includes:  
866-2-29952666, x131  
Pin-Fin Heatsink  
Thermal Interface  
C99237-001  
CCI  
CCI  
Harry Lin (CCI/ACK-USA)  
714-739-5797  
Material  
Ramp Clip  
Wire Clip  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Pin-Fin Heatsink  
C92139-001  
C34795-001  
Harry Lin (CCI/ACK-USA)  
714-739-5797  
Scott Miller  
Thermal Interface  
(PCM 45F)  
Honeywell  
PCM 45F  
509-252-2206  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Heatsink Ramp Clip  
C92140-001  
CCI  
Harry Lin (CCI/ACK-USA)  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Heatsink Wire Clip  
C85373-001  
CCI  
Harry Lin (CCI/ACK-USA)  
714-739-5797  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Appendix A: Thermal Solution Component Suppliers  
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Intel Part  
Number  
Supplier  
(Part Number)  
Part  
Contact Information  
Rick Lin  
Deputy Manager/Project Sales  
Department  
Add.: 7F, No. 276, Section 1, Tatung  
Road, Hsichih City, Taipei Hsien, Taiwan  
Tel: 886-2-2647-1896 ext. 6342  
Mobile: 886-955644008  
Solder-Down Anchor  
C85376-001  
Wieson  
Email: rick@wieson.com  
NOTE: The enabled components may not be currently available from all suppliers. Contact the supplier directly  
to verify time of component availability.  
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Appendix B: Mechanical Drawings  
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8 Appendix B: Mechanical Drawings  
Table 8-1 lists the mechanical drawings included in this appendix.  
Table 8-1. Mechanical Drawing List  
Drawing Description  
Figure Number  
Plastic Wave Soldering Heatsink Assembly Drawing  
Plastic Wave Soldering Heatsink Drawing (1 of 2)  
Plastic Wave Soldering Heatsink Drawing (2 of 2)  
Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2)  
Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2)  
Plastic Wave Soldering Heatsink Wire Clip Drawing  
Plastic Wave Soldering Heatsink Solder-Down Anchor Drawing  
Intel® 955X Express Chipset Thermal/Mechanical Design Guide  
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Appendix B: Mechanical Drawings  
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Figure 8-1. Plastic Wave Soldering Heatsink Assembly Drawing  
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Appendix B: Mechanical Drawings  
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Figure 8-2. Plastic Wave Soldering Heatsink Drawing (1 of 2)  
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Appendix B: Mechanical Drawings  
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Figure 8-3. Plastic Wave Soldering Heatsink Drawing (2 of 2)  
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Appendix B: Mechanical Drawings  
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Figure 8-4. Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2)  
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Appendix B: Mechanical Drawings  
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Figure 8-5. Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2)  
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Appendix B: Mechanical Drawings  
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Figure 8-6. Plastic Wave Soldering Heatsink Wire Clip Drawing  
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Appendix B: Mechanical Drawings  
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Figure 8-7. Plastic Wave Soldering Heatsink Solder-Down Anchor Drawing  
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